by Software Cradle Co., Ltd.
PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool’s easy and quick operation in 2D.
You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage. There have been rising demands for smaller, more tightly sealed and quieter electronic devices. To meet the demands, thermal design of the whole devices has become insufficient and thermal design of components such as PCBs is now vital.
PICLS Product Brochure
Learn about PICLS, the new tool from Software Cradle that provides you easy and quick operation in 2D for thermal simulation of PCBs
Hitachi Mito Engineering Case Study
To minimize tasks and improve process eﬃciency during the early phases of development, Hitachi Mito Engineering conduct simulations for thermal design processes using analysis tools developed by Software Cradle.
Software Cradle’s PICLS is designed to minimize the tasks on design engineers in early development phase, which is imperative for front loading. Using this tool, design engineers can perform thermal analyses of PCBs even during conceptual phase of the development.
About Software Cradle
Software Cradle is a Professional Engineering Group with the best-in-class recognized CFD software in the thermo-fluid analysis field in Japan. Since their establishment in 1984, they have worked closely with customers to understand their problems and needs, and reflect them in Software Cradle's technological development.
Key Features & Benefits
As analyses become more complicated and advanced, longer time is required to calculate. This is why analysts often fail to provide analysis results that meet the design engineers’ requirements in a short amount of time. PICLS can solve this problem by limiting the operations to upstream design. One click and analysis results can be generated real-time. It helps discussions between engineers and PCB evaluations during design reviews as it enables users to undertake thermal analyses on the spot.
In order to achieve front loading, it is important to effectively apply evaluation results from upstream design process to downstream design process. After the evaluation using PICLS, PCB data can be passed onto a system level thermal fluid analysis tool that is used during mechanism design process.
PICLS can be used for thermal simulation of PCBs in any industry which designs circuit boards including: aerospace, automotive & ground transportation, biomedical, consumer goods, electronics and energy.
- Check heat transfer and evaluate changes in temperature distribution in real-time
- Identify thermal problems early in the design phase
- Conduct PCB thermal analyses
- Collaboratively develop solutions with the CAE analysts
After the evaluation using PICLS, PCB data can be passed onto a system level thermal fluid analysis tool that is used during mechanism design process. You can import the data of a PCB created in PICLS to scSTREAM, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.
SC/Tetra by Software Cradle is an all-in-one thermo-fluid analysis system that uses un-structured mesh.
scSTREAM by Software Cradle is a CFD software that captures geometric shape in a structured mesh.